Drop Impact Test Simulation

Category: 構造解析 / 過渡応答解析 | 更新 2026-04-11
FEM drop test simulation showing stress distribution during smartphone impact on rigid floor
落下衝撃試験シミュレーション ── 衝突瞬間の応力分布と変形挙動をFEMで予測する

Theory and Physics

Mechanics of Free Fall

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Teacher, I want to predict the impact when a smartphone is dropped using FEM. Can you first teach me the basic physics of falling?

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Good question. The starting point for drop testing is free fall ignoring air resistance. The velocity of an object released gently from a height $h$ at the moment it hits the floor can be derived from the law of conservation of energy:

$$ mgh = \frac{1}{2}mv^2 \quad \Rightarrow \quad v = \sqrt{2gh} $$

For example, dropping a smartphone from a height of 1.2 m (about the height when taking it out of a pocket):

$$ v = \sqrt{2 \times 9.81 \times 1.2} \approx 4.85 \text{ m/s} $$

Giving this velocity as the "initial velocity" to the product is the basic setup method for drop FEM. The mass $m$ cancels out as if by promise, but of course it affects the deformation and stress after impact.

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4.85 m/s is about 17 km/h when converted to speed, right? Thinking about hitting the ground at bicycle speed is pretty fast...

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Yes, and the contact time is extremely short. When a smartphone corner hits a concrete floor, the contact time is only 0.3~0.5 ms. Since the change in momentum $\Delta p = mv$ occurs in this short time, the average impact force is:

$$ F_{avg} = \frac{mv}{\Delta t} = \frac{0.2 \times 4.85}{0.0004} \approx 2{,}425 \text{ N} $$

About 2,400 N of force on a 200 g object means an acceleration of about 1,200 G. This is what destroys solder joints on electronic components.

Contact Mechanics of Impact

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At the moment of impact, how is the contact force calculated? Can we simply think of it like a spring?

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Actually, for elastic collisions, Hertzian contact theory is the basis. When two elastic bodies contact, the relationship between contact force $F$ and approach (indentation) $\delta$ is:

$$ F = K_H \cdot \delta^{3/2} $$

Here $K_H$ is the Hertzian contact stiffness, determined from the elastic modulus, Poisson's ratio, and radius of curvature of both objects. However, in drop testing, plastic deformation and fracture occur, so Hertz theory alone is insufficient. In FEM, the nonlinear contact force is directly calculated by solving the elastoplastic constitutive law at the element level.

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How is contact handling in FEM done specifically?

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There are mainly two methods: the penalty method and the Lagrange multiplier method. In practical drop analysis, the penalty method is overwhelmingly common. The mechanism is simple: when two surfaces try to penetrate, a virtual spring pushes them back:

$$ F_{contact} = k_p \cdot g_n \quad (g_n < 0 \text{ when}) $$

$k_p$ is the penalty stiffness, $g_n$ is the gap (negative means penetration amount). If $k_p$ is too small, the product "passes through" the floor; if too large, the time step becomes extremely small and computational cost explodes. Running with default values first and then fine-tuning is the practical approach.

Energy Balance and Absorption Mechanisms

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Where does all the energy from the drop go? Even if it doesn't break, sometimes it doesn't bounce back, right?

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A very important point. The total energy before impact is kinetic energy $E_k = \frac{1}{2}mv^2$, and after impact, this is distributed into several forms:

$$ E_k = E_{elastic} + E_{plastic} + E_{friction} + E_{damping} + E_{rebound} $$
  • Elastic strain energy $E_{elastic}$ — The part that returns after deformation. Source of bounce energy.
  • Plastic dissipation energy $E_{plastic}$ — Consumed in permanent deformation. Dents or cracks in the housing.
  • Friction energy $E_{friction}$ — Consumed by sliding on the contact surface.
  • Damping energy $E_{damping}$ — Absorbed by material viscosity.
  • Rebound energy $E_{rebound}$ — Kinetic energy after bouncing.

Expressed by the coefficient of restitution (COR) $e$, $E_{rebound} = e^2 \cdot E_k$. When a smartphone glass surface hits tile, $e \approx 0.2\text{~}0.4$, and most of the energy is consumed by plastic deformation and internal damping.

Drop Orientation and Stress Concentration

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I heard the results change quite a bit depending on the drop angle. Which orientation is the most severe?

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Drop orientation dramatically changes the results. Even for the same 1.2 m drop, local stress can differ by more than 10 times between a flat drop and a corner drop:

Drop OrientationInitial Contact AreaPeak AccelerationFailure RiskTypical Damage
Flat DropLarge (entire surface)200~500 GLowLCD crack, substrate bending
Edge DropMedium (line)500~1,500 GMediumFrame deformation, button damage
Corner DropVery small (point)1,000~5,000 GMaximumHousing crack, IC detachment

IEC 60068-2-31 requires drops from a total of 26 directions: 6 faces, 12 edges, 8 corners. In FEM, at least the three representative orientations (face, edge, corner) are essential, and ideally all 26 directions should be run to see design margins.

🧑‍🎓

26 directions... even if one analysis takes 30 minutes, that's 13 hours... Is that realistic?

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That's exactly where HPC clusters come in. Major companies like Samsung and Apple run all 26 directions in parallel on dozens of workstations and get all results in one day. For small and medium-sized enterprises, it's realistic to first narrow it down to a total of 4 cases: 3 corner drops + 1 flat drop to identify the most severe conditions.

Strain Rate Effect

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The textbook said strain rate effects are significant in impact problems. Do we need to consider them in drop testing too?

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Essential. The typical strain rate in drop impact is $10^1 \sim 10^3$ /s, which is over 10,000 times that of quasi-static tests ($10^{-3}$ /s). Many metals and plastics show increased yield stress at high strain rates. A representative model is the Cowper-Symonds law:

$$ \sigma_y = \sigma_0 \left[ 1 + \left( \frac{\dot{\varepsilon}}{D} \right)^{1/q} \right] $$

$\sigma_0$ is the quasi-static yield stress, $D$ and $q$ are material constants. For example, for polycarbonate (PC), $D = 10$ /s, $q = 2$ approximately, and at a strain rate of 100 /s, the yield stress jumps to about 3 times the quasi-static value. Ignoring this risks the simulation deforming more than in reality and misjudging it as "broken".

Coffee Break Trivia

iPhone Drop Test Anecdote

It is said that during the development of the first-generation iPhone, Apple dropped dozens of prototypes per day. Since the iPhone 12, the adoption of Ceramic Shield glass is said to have improved drop resistance by 4 times, but behind this "4 times" are thousands of parametric analyses using LS-DYNA. The result of modeling microscopic crack propagation in glass with cohesive elements and optimizing the edge chamfer curvature in 0.1 mm increments.

Governing Equations for Drop Impact
  • Equation of motion: $M\ddot{u} + C\dot{u} + F_{int}(u) = F_{ext}(t)$ ── In drop impact, the inertial term $M\ddot{u}$ dominates. Since acceleration reaches thousands of G, quasi-static analysis is completely inappropriate.
  • Contact force: $F_{contact} = k_p \cdot \max(0, -g_n)$ ── Contact force by penalty method. $g_n$ is the gap distance, and force is generated only when negative (penetration).
  • Energy conservation: $E_{total} = E_k + E_{internal} + E_{contact} + E_{hourglass}$ ── The time variation of total energy must be within ±5% of the initial value as a condition for sound analysis.
  • CFL condition: $\Delta t \leq \frac{L_{min}}{c}$ ── Stability limit for explicit methods. $L_{min}$ is the minimum element length, $c = \sqrt{E/\rho}$ is the elastic wave speed. For steel, $c \approx 5{,}000$ m/s, so for a 1 mm element, $\Delta t \leq 0.2$ μs.
Notes on Unit Systems (Frequent in Drop Analysis)
Physical QuantitySI (m system)mm-ms-tonne systemConversion Note
Lengthmmm1 m = 1000 mm
Timesms1 s = 1000 ms
Masskgtonne1 kg = 0.001 tonne
Velocitym/smm/msNumerical value is the same (1 m/s = 1 mm/ms)
ForceNNSame
StressPaMPa1 MPa = 10⁶ Pa
Densitykg/m³tonne/mm³Steel: 7.85×10⁻⁹ tonne/mm³
Gravitational acceleration9810 mm/s²9.81×10⁻³ mm/ms²LS-DYNA uses mm/ms²

Numerical Methods and Implementation

Explicit Method Time Integration

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I heard that explicit methods are almost always used in drop analysis. Can't we use implicit methods?

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Drop impact is an ultra-short duration phenomenon of a few milliseconds where contact initiation/termination, large deformation, and material plasticity occur simultaneously. With implicit methods, it's necessary to solve simultaneous equations every step, and convergence becomes difficult each time contact conditions change. With the explicit method based on the central difference method:

$$ u^{n+1} = 2u^n - u^{n-1} + \Delta t^2 \cdot M^{-1} \cdot (F_{ext}^n - F_{int}^n) $$

If the mass matrix $M$ is diagonalized (lumped mass), there is no need to solve simultaneous equations. Since the acceleration of each node can be calculated independently, it progresses stably even for problems with strong nonlinearity. However, it is conditionally stable, and the stable time step is:

$$ \Delta t_{stable} \leq \frac{L_{min}}{c} = \frac{L_{min}}{\sqrt{E/\rho}} $$

For a 1 mm hexahedral steel element, $\Delta t \approx 0.2$ μs. Simulating a 5 ms collision phenomenon requires about 25,000 steps.

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25,000 steps is an amazing number. But each step is light, so overall it's fast...

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Exactly. For a model like a smartphone (500k elements), using LS-DYNA with 16 cores finishes in 30 minutes to 1 hour. Trying to solve the same problem with an implicit method, convergence fails due to contact switching and it could take days. Using explicit methods in drop analysis isn't just because "it's fast," but because "it can be solved."

Contact Algorithm

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A senior told me contact settings are the most difficult. Specifically, what should I do?

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Contact in drop analysis is broadly divided into two:

  • Product vs. Floor surface — External contact. Defining the floor as a rigid surface is efficient as it requires no elements. Very hard surfaces like concrete or tile are sufficiently approximated as rigid.
  • Self-contact inside the product — Cases where the housing deforms and contacts internal substrates or batteries. Often overlooked but important for electronic devices.

In LS-DYNA, *CONTACT_AUTOMATIC_SINGLE_SURFACE is standard, automatically detecting all outer surfaces as one contact group. For the penalty stiffness scale factor (SFS/SFM), running first with the default 1.0 and then increasing to 2.0~5.0 if penetration is observed is practical.

LS-DYNA Input Example

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Can you show me specific LS-DYNA keyword settings? Assuming a flat drop from 1 m.

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Writing in the mm-ms-tonne system, the impact velocity for a 1 m drop is $v = \sqrt{2 \times 9.81 \times 1.0} = 4.43$ m/s = 4.43 mm/ms. Set it like this:

$ --- Initial velocity (apply downward velocity to entire product set) ---
*INITIAL_VELOCITY_SET
$  nsid    vx      vy      vz
   1,      0.0,    0.0,    -4.43

$ --- Gravity (only needed for tracking bounce) ---
*LOAD_BODY_Z
$  lcid    sf
   1,      1,      9.81e-3   $ mm/ms^2

$ --- Rigid wall (infinitely hard floor surface) ---
*RIGIDWALL_PLANAR
$  xt  yt  zt  xh  yh  zh
   0., 0., 0., 0., 0., 1.

$ --- Contact (automatic single surface) ---
*CONTACT_AUTOMATIC_SINGLE_SURFACE
$  ssid  msid  sstyp  mstyp  sboxid  mboxid  spr  mpr
   1,    0,    3,     0,     0,      0,      1,   1
$ fs    fd    dc     vc
  0.3,  0.2,  0.,    0.

$ --- Time control ---
*CONTROL_TIMESTEP
$  dtinit  tssfac
   0.,     0.9

The key point is using TSSFAC=0.9, which uses 90% of the stable time step. The default 0.9 is usually OK, but for severe contact, it might be reduced to 0.67.

Abaqus/Explicit Input Example

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How is it written in Abaqus/Explicit? My company uses Abaqus...

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Abaqus often uses the SI (m system). Settings for the same 1 m drop:

** --- Initial velocity ---
*INITIAL CONDITIONS, TYPE=VELOCITY
product_set, 3, -4.43

** --- Gravity ---
*DLOAD
product_set, GRAV, 9.81, 0., 0., -1.

** --- Rigid floor (analytical rigid surface) ---
*RIGID BODY, REF NODE=floor_rp,
  ANALYTICAL SURFACE=floor_surf
*SURFACE, TYPE=PLANAR, NAME=floor_surf
  DATA LINE: 0., 0., 0., 0., 0., 1.

** --- General contact (recommended) ---
*CONTACT, OP=NEW
*CONTACT INCLUSIONS, ALL EXTERIOR

** --- Step (5 ms analysis) ---
*DYNAMIC, EXPLICIT
  , 0.005

Abaqus's General Contact is very convenient, automatically registering all outer surfaces as contact candidates. It's a similar concept to LS-DYNA's AUTOMATIC_SINGLE_SURFACE. Defining the floor as an analytical rigid surface eliminates the need for floor meshing and improves computational efficiency.

Element Selection and Mesh Strategy

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Which element type should I choose? I'm torn between solid and shell.

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In drop analysis, choose based on part thickness and deformation characteristics:

PartRecommended ElementLS-DYNAAbaqusReason
Housing (1~3 mm thick)ShellELFORM=2 (BT)S4R5 integration points through thickness ensures bending accuracy
Substrate (0.8~1.6 mm)ShellELFORM=16 (full integration)S4Accurate capture of warping deformation
IC/BGA (solder joints)SolidELFORM=1 (reduced integration)C3D8R3D stress state evaluation needed
Rubber gasketSolidELFORM=-1 (full integration)C3D8H (mixed formulation)Avoids volumetric locking for incompressible rubber
Foam cushionSolidELFORM=1C3D8RHandles large compression deformation

Mesh size must be sufficiently fine relative to the impact wave wavelength. As a rule of thumb, near contact surfaces, element size 0.5~1.0 mm, elsewhere 2~5 mm, with at least 5 integration points for shells or 3 layers for solids in the thickness direction.

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What if hourglass modes appear with reduced integration?

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