Process Conditions
Process
Material
Nozzle Temperature T_n
210 °C
Bed Temperature T_b
60 °C
Layer Height h
0.20 mm
Line Width w
0.40 mm
Print Speed v
60 mm/s
Infill Rate
20 %
Part Volume
50 cm³
Laser Power P
200 W
Scan Speed
1000 mm/s
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Build Time [h]
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Layer Time [s]
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Energy [kWh]
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Warping Risk Index
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Energy Density ED [J/mm³]
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Layer Bonding
Layer Cross-Section (Temperature Gradient)
Bead Temperature vs. Position
Build Time vs. Print Speed
Governing Equations
FDM build time: $t_{build} = \dfrac{V_{part} \times fill}{h \times w \times v} \times (1 + f_{overhead})$
Bead cooling (Newton's cooling): $T(x) = T_{bed} + (T_n - T_{bed}) \cdot e^{-x/L_c}$
Warping risk: $W_{risk} = CTE \times (T_n - T_{bed}) \times L_{part}$
DMLS energy density: $ED = \dfrac{P}{v_{scan} \times h_{layer} \times d_{hatch}}$ [J/mm³]
CAE Integration: DMLS residual stress and distortion can be predicted with Abaqus/Simufact thermo-structural coupled analysis. ED is the primary parameter for process optimization. The warping risk index is useful for initial FEM thermal stress studies.