$$m = \frac{M \cdot I \cdot t \cdot \eta}{n \cdot F}$$
$F = 96485$ C/mol (Faraday constant)
$\delta = m / (\rho \cdot A)$ — thickness
$J = I / A$ — current density
$P = V \cdot I$ — power
Apply Faraday's Law to electroplating, water electrolysis and electrorefining. Instantly compute deposited mass, film thickness, current density and energy consumption.
$$m = \frac{M \cdot I \cdot t \cdot \eta}{n \cdot F}$$
$F = 96485$ C/mol (Faraday constant)
$\delta = m / (\rho \cdot A)$ — thickness
$J = I / A$ — current density
$P = V \cdot I$ — power
The core of the calculation is Faraday's First Law of Electrolysis, which relates the mass of substance altered at an electrode to the electric charge passed.
$$m = \frac{M \cdot I \cdot t \cdot \eta}{n \cdot F}$$$m$ = mass deposited (g)
$M$ = molar mass of the substance (g/mol) — select from the dropdown.
$I$ = current (A)
$t$ = time (s)
$\eta$ = current efficiency (unitless, as a decimal)
$n$ = number of electrons transferred per ion (e.g., $n=2$ for $Cu^{2+}$)
$F$ = Faraday constant, 96485 C/mol (charge of one mole of electrons)
For engineering applications, the deposited mass is often converted into a plating thickness, which is a critical design specification.
$$\delta = \frac{m}{\rho \cdot A}$$$\delta$ = plating thickness (cm)
$\rho$ = density of the plated material (g/cm³) — selected automatically based on material.
$A$ = surface area of the substrate (cm²)
This equation shows thickness is inversely proportional to area: plating the same mass onto a smaller object yields a thicker layer.
Decorative & Protective Electroplating: This is the most common use. A thin layer of a desirable metal (like chromium, gold, or nickel) is deposited onto a cheaper base metal (like steel or brass) for corrosion resistance, wear resistance, and appearance. For instance, the shiny, rust-resistant finish on car bumpers, bathroom faucets, and jewelry is achieved this way.
Electrorefining of Metals: Impure metal anodes (e.g., blister copper) are dissolved, and pure metal is deposited at the cathode. This process is how we obtain high-purity copper (99.99%+) for electrical wiring. The simulator's current efficiency parameter is crucial here, as side reactions directly impact yield and cost.
Electroforming: This is additive manufacturing via electroplating. Metal is deposited onto a mandrel (mold) to build up a solid, freestanding object, which is later separated. Common applications include producing intricate nickel meshes for filters, waveguide components for aerospace, and even some musical instrument bells.
Anodizing: While not a plating process, it's a key electrochemical surface treatment. Here, the workpiece is the anode, and an oxide layer (like on aluminum) is grown to enhance corrosion resistance and provide a base for dye. Controlling current density (the $J = I/A$ calculation in the tool) is critical for achieving a uniform, hard anodized layer.
When you start using this calculation tool, there are several pitfalls that beginners on the shop floor often encounter. First and foremost, understand that current efficiency is not a fixed value. While you input it as a constant in the tool, in an actual plating bath, the current efficiency changes with current density (current per unit area), temperature, and bath composition. For example, in nickel plating, if you raise the current density too high, hydrogen evolution can become vigorous, causing efficiency to drop from around 90% to near 70%. When results don't match your calculations, re-evaluating the efficiency is your first step.
Next, there is the fundamental fact that "coating thickness will not be uniform". The result from this calculation is only the "average thickness". On an actual electrode (especially parts with complex shapes), corners and protrusions experience current concentration leading to thicker plating (over-plating), while recessed areas become thinner (under-plating). You use the total surface area to be plated for area "A", but considering uniformity requires a separate dimension of analysis: "current distribution".
Finally, be very careful about unit confusion. The calculation formula uses [cm] and [g/cm³], but on the shop floor, thickness is commonly in [μm] and area in [dm²] (the unit "1 square decimeter" is frequently used, especially in decorative plating). Even if the tool handles conversions internally, ensure unit consistency when doing manual calculations. For instance, mistakenly inputting an area of 10 cm² (=0.1 dm²) as 1 dm² would make the calculated thickness ten times different—a potential disaster.
Copper electroplating: 5 amperes applied for 120 minutes with 95% efficiency. Cu atomic mass = 63.5 g/mol, n = 2 electrons. Moles deposited = (5 × 7200 s × 0.95) / (2 × 96485) = 0.177 mol. Mass = 0.177 × 63.5 = 11.24 grams of copper on cathode. For industrial nickel electrorefining at 1000 A, 8 hours, 98% efficiency: Ni (58.7 g/mol, n=2) yields 86.3 kg refined nickel per batch.