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Laplace Equation
$$\nabla^2 T = \frac{\partial^2 T}{\partial x^2}+\frac{\partial^2 T}{\partial y^2}=0$$Jacobi iteration update:
$$T_{i,j}^{n+1}= \frac{T_{i+1,j}^n+T_{i-1,j}^n+T_{i,j+1}^n+T_{i,j-1}^n}{4}$$Paint heat sources, cold sinks, and insulators freely on the canvas. The Laplace equation is solved with Jacobi iteration to render a realistic thermography-style temperature map.
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Jacobi iteration update:
$$T_{i,j}^{n+1}= \frac{T_{i+1,j}^n+T_{i-1,j}^n+T_{i,j+1}^n+T_{i,j-1}^n}{4}$$At steady state (when temperatures no longer change with time), heat conduction in a solid without internal heat generation is governed by Laplace's equation. This means the net heat flow into any tiny region is zero.
$$\nabla^2 T = \frac{\partial^2 T}{\partial x^2}+\frac{\partial^2 T}{\partial y^2}=0$$Here, $T$ is temperature, and $\nabla^2$ is the Laplace operator. The equation states that the second spatial derivatives (a measure of curvature) of temperature sum to zero, leading to smooth, harmonic temperature distributions.
To solve this equation numerically on a pixel grid, we use the Jacobi iteration method. We discretize the domain into cells and repeatedly update each cell's temperature based on its neighbors.
$$T_{i,j}^{n+1}= \frac{T_{i+1,j}^n+T_{i-1,j}^n+T_{i,j+1}^n+T_{i,j-1}^n}{4}$$Here, $T_{i,j}^{n+1}$ is the new temperature at grid position (i,j), calculated as the average of its four orthogonal neighbors' temperatures from the previous iteration step $n$. Cells marked as heat sources, cold sinks, or insulators are held fixed and do not update.
Electronics Cooling: Designing heat sinks and circuit board layouts to prevent overheating. Engineers use this exact type of simulation to place hot components (like CPUs) and cooling elements optimally, ensuring efficient heat spread to the edges of the device.
Building Science: Analyzing thermal bridges and insulation effectiveness in walls. By modeling materials with different conductivities (like wood studs vs. fiberglass insulation), architects can predict cold spots that might lead to condensation and mold growth.
Geothermal Studies: Modeling the steady-state temperature distribution in the ground around buried pipelines or geothermal heat exchange systems. This helps in sizing systems and predicting long-term efficiency.
Manufacturing & Materials Processing: Predicting temperature profiles during processes like annealing metal sheets or curing composite materials. Uniform heating is critical for product quality, and simulations help design oven heating elements and conveyor layouts.
There are a few key points you should be especially mindful of when starting to use this tool. First, understand that "the simulation results are not absolute temperature values." The "100°C" or "0°C" on the tool are relative benchmarks. In reality, the actual heat generation (wattage) of a source and the thermal conductivity of materials significantly alter the outcome. For instance, the same "100°C" setting will have a completely different thermal impact on the surroundings for a small LED versus a large CPU. Think of this tool as a way to see "relatively where temperatures are high and how heat tends to spread."
Next, be aware of boundary condition setup errors. In this simulator, the four edges of the board are treated as "adiabatic walls" (no heat escapes). However, a real PCB is exposed to air, and building walls are in contact with outside air. Therefore, if heat appears excessively trapped in the simulation, the real-world temperature is likely lower. In practice, figuring out how to model this "heat exchange with the surroundings" is often the most challenging part.
Finally, consider the interpretation of "steady state." The tool calculates a steady state through iteration, but the time it takes for a real product to reach "steady state" is not negligible. For example, a smartphone heats up rapidly right after launching a heavy game, but what you see on a thermogram is the state a moment later. Since the simulation results show the "final stabilized temperature distribution," this tool alone cannot evaluate the risk of transient thermal runaway. Use it as a first step in your basic design process.
Simulate a steel plate (0.5 m × 0.5 m, k=50 W/m·K) with a 300°C heat source applied to the left edge and a 20°C cooling sink on the right edge. Paint the left region at hotTempVal=300, paint the right region at coldTempVal=20, and run iterSlider=250 iterations. The thermal camera displays a linear gradient from orange (≈280°C mid-plate) to blue (≈30°C near sink), with isothermal contours visible after 200+ iterations. Time to convergence: approximately 15–20 solver steps for 0.01°C residual accuracy.