Conjugate Heat Transfer Analysis

Category: Coupled Analysis – Thermo-Fluid | Revised 2026-10-01
CAE visualization for conjugate heat transfer theory - technical simulation diagram
Conjugate Heat Transfer Analysis

Theory: the heat transfer coefficient isn't known in advance

Overview

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In thermal analysis, a heat transfer coefficient on the surface represents cooling. Why solve the fluid as well?

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Because the coefficient isn't a material constant — it depends on the flow and the wall temperature distribution. In the same flow, the leading edge with its thin boundary layer cools well and downstream cools less; and if wall temperature varies, air warmed upstream weakens cooling downstream. If the solid spreads heat well, the wall is nearly uniform and an average coefficient suffices, but for poorly conducting solids the local peak changes a lot. Conjugate analysis solves solid and fluid together to handle this. Let's compare plate materials.

Interface conditions

$$ T_s = T_f,\qquad -k_s\frac{\partial T_s}{\partial n} = -k_f\frac{\partial T_f}{\partial n}\quad(\text{interface}) $$

Both temperature and heat flux are continuous at the solid–fluid boundary; the heat transfer coefficient comes out of the solution afterwards.

Fluid side: response to wall temperature

$$ h(x,\xi) = 0.332\,\frac{k_f}{x}\,Re_x^{1/2}Pr^{1/3}\left[1-\left(\frac{\xi}{x}\right)^{3/4}\right]^{-1/3},\qquad q(x) = \int_0^x h(x,\xi)\,dT_w(\xi) $$

Superposing the laminar flat-plate solution for a temperature step starting at $\xi$ (the unheated-starting-length solution) gives the heat flux for any wall temperature distribution. Here this relation was solved simultaneously with 2D conduction in the solid.

Coffee Break Trivia

The name 'conjugate'

Solving heat in solids and fluids together is usually traced to Perelman and colleagues in the Soviet Union, who treated it systematically in the 1960s as the 'conjugate problem'. Analytical solutions were then limited, but computers made solving solid and fluid on one mesh routine. Conjugate analysis is now standard in electronics thermal design and turbine blade cooling.

Worked example: a heated plate cooled by air

A 100 mm plate is heated uniformly from below at 2000 W/m² and cooled on top by 20 °C air at 2 m/s (laminar, Reynolds number 11,100). No other heat enters or leaves.

Simple estimates

MethodCoefficientSurface temperature
Uniform average coefficient17.4 W/m²K135 °C (uniform)
Local coefficient (trailing edge)11.9 W/m²K188 °C

Conjugate results (2 mm thick)

MaterialConductivityTop min / maxSpreadBottom max
Aluminium200 W/mK134 / 141 °C7 K141 °C
Steel16 W/mK104 / 159 °C55 K159 °C
FR-40.3 W/mK47 / 186 °C139 K199 °C

On FR-4 the top reaches 75 °C at x = 10 mm, 140 °C at 50 mm and 180 °C at 90 mm — hotter downstream. Aluminium stays nearly uniform at 134–141 °C. In every case heat in at the bottom equalled heat out at the top.

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With aluminium the average coefficient is fine, but for FR-4 it underestimates the peak by 50 K.

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Aluminium spreads heat sideways toward the well-cooled leading edge, so the whole plate sits at nearly one temperature — close to the uniform wall the average coefficient assumes. FR-4 barely moves heat sideways, so heat escapes upward where it's generated; the poorly cooled trailing edge gets hot, approaching the 188 °C set by the local coefficient alone. That's why downstream components on low-conductivity boards run hotter, and an analysis with an average coefficient misses it. Steel sits in between, with results sensitive to thickness and material.

How to run the analysis

  1. Match meshes at the interface or connect them by interpolation.
  2. Resolve the thermal boundary layer near walls (check wall-function conditions for turbulence).
  3. For transients with very different time scales, solving fluid steady and solid transient is an option.
  4. Compare with a constant-coefficient analysis to see where they differ.
  5. Include surface radiation where temperatures make it significant.
Coffee Break Trivia

“Only the downstream parts ran hot”

In a power-board thermal analysis with an average coefficient on the fan-cooled face, every component had margin. On the prototype, only the downwind components exceeded limits: air warmed by upstream parts flowed downstream, and the board couldn't spread heat sideways, so downstream cooling fell well below assumptions. A conjugate analysis of board and air reproduced the trend, and rearranging components fixed it.

Common mistakes

Mistakes and fixes

MistakeEffectFix
Uniform average coefficientLocal peak missedCheck with conjugate analysis
Coarse interface meshHeat-flux errorResolve boundary layer
Ignoring contact resistanceTemperature underestimatedAdd interface resistance
Not checking energy balanceUnconverged results unnoticedCompare heat in and out
Ignoring upstream heatingDownstream underestimatedSolve the flow too
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Structural AnalysisElectromagnetic AnalysisThermal Analysis
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