Electromagnetic-Thermal Coupled Simulation of Wireless Charging
Theory and Physics
Wireless charging gets hot, right? What can you learn from simulation?
Good question. When transmitting power via magnetic coupling, heat is always generated from copper loss in the coils and iron loss in the ferrite core. Even with an 80% transmission efficiency for the Qi standard 15W, 3W of loss turns entirely into heat. If this heat is trapped in a smartphone's thin casing, the battery temperature can exceed 45°C, shortening its lifespan.
Is just 3W really a problem? EV charging seems much tougher...
Exactly. For 11kW wireless EV charging (SAE J2954 WPT3 class), even with 90% efficiency, that's 1.1kW of loss. Cooling design to keep the charging pad surface temperature below 60°C is essential. Without predicting the temperature distribution using coupled electromagnetic-thermal FEM, you'd end up repeating prototyping many times.
Basics of Wireless Power Transfer (WPT)
What's the principle behind wireless charging anyway? It's electromagnetic induction, right?
Simply put, it's a mechanism where high-frequency current flows through the transmitting coil (Tx) to generate an alternating magnetic field, and the receiving coil (Rx) picks up that magnetic flux to generate an electromotive force. Think of it like spatially separating the primary and secondary windings of a transformer.
There are three main WPT methods:
- Electromagnetic Induction — Qi standard smartphone charging. Coil distance: a few mm to 1cm. Frequency: 100-200kHz.
- Magnetic Resonance — EV charging and AirFuel. Coil distance: 5-30cm. Efficiency improved with resonant circuits. 85kHz (SAE J2954 standard).
- Microwave Method — Long-distance power transfer. GHz band. Low efficiency but can cover distance. For IoT sensors.
The two methods with the greatest demand for thermal design are electromagnetic induction and magnetic resonance.
Coupling Coefficient and Transmission Efficiency
I often hear about "coupling coefficient," but how exactly does it relate to efficiency?
The coupling coefficient $k$ represents the degree of magnetic flux coupling between the transmitting and receiving coils. Using mutual inductance $M$ and the self-inductance of each coil $L_1, L_2$:
$k=1$ is the ideal state where all magnetic flux links the other coil (like inside a transformer core). In actual wireless charging, $k$ is around $0.1\sim0.6$. $k$ decreases as the coil distance increases or if they are misaligned.
Transmission efficiency $\eta$ can be approximated using the quality factor of each coil $Q_1 = \omega L_1 / R_1$, $Q_2 = \omega L_2 / R_2$:
I see, so when $k$ is small, efficiency drops, and all that loss becomes heat.
Exactly. The total loss relative to input power is:
For example, for 11kW EV charging with $\eta=0.90$, $P_{\text{loss}} = 1.1\,\text{kW}$. If $k$ halves from 0.3 to 0.15, $\eta$ drops from about 0.9 to 0.7, causing $P_{\text{loss}}$ to jump to $3.3\,\text{kW}$. That's why allowable misalignment and thermal design must be considered together.
Loss Breakdown and Heating Mechanism
You mention losses like 3W or 1.1kW, but where exactly is the heat generated?
Losses can be largely broken down into three parts. This is the breakdown of heat sources:
1. Copper Loss (Joule heating in coil conductors)
$I^2 R$ loss from current flowing in the coil wire. However, at WPT frequencies (85-200kHz), the effective resistance becomes several to tens of times the DC resistance due to skin effect and proximity effect:
Here $F_r$ is the AC resistance factor, which depends on the skin depth $\delta = \sqrt{2\rho / (\omega \mu)}$. For copper at 100kHz, $\delta \approx 0.21\,\text{mm}$, so with a single round wire, current doesn't flow in the center, reducing efficiency. That's why litz wire (structure of twisted thin strands) is used.
2. Iron Loss (Magnetic loss in ferrite core)
The sum of hysteresis loss and eddy current loss in the ferrite core. Approximated by the Steinmetz equation:
$C_m$, $\alpha$, $\beta$ are constants obtained from the ferrite material's datasheet (typically $\alpha \approx 1.5$, $\beta \approx 2.5$ for MnZn ferrite). $\hat{B}$ is the maximum magnetic flux density in the core, $V_{\text{core}}$ is the core volume.
Often overlooked, ferrite permeability and saturation flux density are highly temperature-dependent. As temperature rises and approaches the Curie temperature, permeability drops sharply, causing magnetic flux to leak outside the core and induce eddy currents in surrounding metals—a nonlinear feedback loop.
3. Shield/Enclosure Eddy Current Loss
Leakage magnetic flux induces eddy currents in aluminum shields behind the coils or metal parts of the smartphone enclosure:
I see, there are three heat sources, and ferrite characteristics change with temperature, making it nonlinear. That's why simulation is needed.
Let's summarize practical loss ratio estimates in a table:
| Loss Source | Qi 15W (Smartphone) | WPT3 11kW (EV) | Main Influencing Factors |
|---|---|---|---|
| Copper Loss (Tx+Rx) | 40-50% | 25-35% | Litz wire structure, frequency, current |
| Ferrite Iron Loss | 20-30% | 30-40% | Core material, flux density, temperature |
| Shield Eddy Current Loss | 15-25% | 15-20% | Shield material/thickness, distance |
| Circuit Loss (inverter, etc.) | 10-15% | 10-20% | MOSFET/GaN devices, switching frequency |
Governing Equations — Coupling of Electromagnetic and Thermal Fields
How do you couple the electromagnetic and temperature fields? Please explain the governing equations.
The electromagnetic field is governed by Maxwell's equations, and the temperature field by Fourier's heat conduction equation. For WPT, we couple quasi-static magnetic field frequency-domain analysis (with magnetic vector potential $\mathbf{A}$ as the unknown) with steady-state or transient heat conduction equations.
Electromagnetic field governing equation (A-V formulation, frequency domain):
Here $\mu$ is permeability (temperature-dependent for ferrite), $\sigma$ is electrical conductivity (copper's $\sigma$ also changes with temperature: $\sigma(T) = \sigma_0 / [1+\alpha_R(T-T_0)]$), $\mathbf{J}_s$ is the source current density.
Heat conduction governing equation:
$Q_{\text{em}}(T)$ is the volumetric heat generation rate obtained from electromagnetic analysis, providing the spatial distribution of the sum of copper, iron, and eddy current losses. This $Q_{\text{em}}$ becomes a function of $T$ through temperature-dependent electrical resistivity and permeability, so bidirectional coupling (strong coupling) is inherently necessary.
So the electromagnetic field changes temperature, temperature changes electrical properties, which changes the electromagnetic field again... it's a loop.
Exactly. However, in practice, we often solve using weak coupling (one-way iteration) by leveraging the fact that "the electromagnetic field response is sufficiently fast compared to temperature changes." We'll explain in detail later.
FOD (Foreign Object) Eddy Current Heating
I heard it's dangerous to put a coin or something on a wireless charger. Is it really that problematic?
This is called the FOD (Foreign Object Detection/Debris) problem and is a very important safety issue. If metal pieces like coins, clips, or aluminum foil get caught between Tx and Rx, large eddy currents are induced by the alternating magnetic field.
A single 1-yen coin (aluminum, diameter 20mm, thickness 1.5mm) can cause several watts of localized heating from eddy current loss if placed in a concentrated flux area, potentially reaching over 100°C. Even for 15W class, with only a thin cloth on the charging pad surface, this poses a fire risk.
Wow, it gets that hot! Can CAE simulate FOD heating too?
Of course. To analyze FOD eddy current loss, calculate the loss distribution using electromagnetic FEM with the object's shape, material, and position as parameters, then input the result into thermal FEM. Maximum loss occurs when the object size is comparable to the skin depth $\delta$, so mesh requires element sizes of $\delta/3$ or smaller. Qi standard verification of FOD detection algorithms also uses these analysis results.
Physical Meaning of Electromagnetic-Thermal Coupling
- Joule Heating Feedback: The electrical resistivity of conductors increases with rising temperature (copper's temperature coefficient $\alpha_R \approx 0.0039\,\text{K}^{-1}$). Increased resistance → increased loss → further temperature rise, creating a positive feedback loop. Under normal WPT conditions, it converges to a stable point without divergence, but extreme overload risks thermal runaway.
- Ferrite Temperature Dependence: MnZn ferrite Curie temperature is 200-300°C. Around 100°C, permeability already drops significantly, causing a cascade: change in coupling coefficient $k$ → reduced transmission efficiency → increased loss. The Steinmetz parameters $C_m$, $\alpha$, $\beta$ themselves are also temperature-dependent, making it desirable to use a modified Steinmetz model (iGSE method).
- Skin Effect Temperature Dependence: Skin depth $\delta = \sqrt{2\rho/(\omega\mu)}$ is proportional to the square root of resistivity $\rho$. As temperature rises and $\rho$ increases, $\delta$ also increases, allowing current to penetrate slightly deeper. The AC resistance factor $F_r$ changes, so the temperature dependence of copper loss cannot be captured by simple linear scaling of $I^2R$.
Key Unit Systems and Dimensions
| Physical Quantity | Symbol | SI Unit | Typical Value (Qi 15W) |
|---|---|---|---|
| Coupling Coefficient | $k$ | Dimensionless | 0.4-0.6 |
| Quality Factor | $Q$ | Dimensionless | 50-200 |
| Skin Depth | $\delta$ | m | 0.21 mm (Cu, 100kHz) |
| Volumetric Heat Generation Rate | $Q_{\text{em}}$ | W/m³ | $10^5$-$10^7$ |
| Core Loss Density | $P_v$ | kW/m³ | 100-500 (MnZn ferrite, 100kHz, 100mT) |
| Thermal Conductivity | $\lambda$ | W/(m·K) | Copper:400, Ferrite:3.5-5, Resin:0.2-0.5 |
When a smartphone heats up during charging, it's the "coil," not the "battery," that's the cause
When users feel "the smartphone is hot during wireless charging," the cause is often not the battery's own heat generation, but the loss from the receiving coil and ferrite sheet being transmitted to the hand through the back glass. In iPhone's MagSafe (7.5-15W), a graphite sheet and shield plate are laminated directly under the receiving coil, and CAE analysis confirms that this area's temperature can be 10-15°C higher than the battery. Smartphone makers like Apple and Samsung leverage this temperature difference to implement "thermal throttling for battery protection"—a mechanism that monitors temperature with a thermistor near the coil and automatically reduces charging power when a threshold is exceeded.
Numerical Methods and Implementation
Coupling Analysis Strategy — Weak Coupling vs. Strong Coupling
What's the efficient way to solve the coupling of electromagnetic and temperature fields? I heard there are methods to solve everything simultaneously and methods to solve alternately.
The key point in electromagnetic-thermal coupling for WPT is the large difference in time scales between the two physical fields:
- Electromagnetic field: Frequency 85-200kHz → Period 5-12μs
- Temperature field: Thermal diffusion characteristic time $\tau = L^2/\alpha_{\text{th}}$ → Several to tens of seconds for smartphone coils
This means the electromagnetic field reaches steady state orders of magnitude faster than the temperature field. Therefore, in practice, weak coupling (Sequential Coupling) is standard:
- Solve the electromagnetic field in the frequency domain using material properties at current temperature $T^n$
- Solve the heat conduction equation using the obtained loss distribution $Q_{\text{em}}(T^n)$ as the heat source, obtaining $T^{n+1}$
- Repeat 1-2 until the temperature change meets a convergence criterion (e.g., $\|T^{n+1} - T^n\| / \|T^n\| < 10^{-3}$)
Are there cases where strong coupling is needed?
When the ferrite core is near its Curie temperature (temperature region where permeability changes rapidly) or for high-power WPT (50kW and above) where temperature rise reaches several hundred °C, property changes due to temperature significantly affect solution stability, so strong coupling (Monolithic) or weak coupling with sub-iterations becomes necessary.
However, for consumer products under the Qi standard or SAE J2954 EV charging, weak coupling converges in about 3-5 iterations, so it's sufficient in practice.
Electromagnetic Field FEM Formulation
How is electromagnetic FEM different from structural analysis FEM?
In structural analysis, nodal displacements are scalar or vector degrees of freedom, but in electromagnetic FEM, the magnetic vector potential $\mathbf{A}$ is the unknown. For 3D problems, using edge elements (Edge Element, Nedelec element) is standard, offering the advantage of naturally satisfying gauge conditions, unlike nodal elements.
The weak form is:
Here $\mathbf{w}$ is the basis function for edge elements. Discretization yields a complex system of equations $[K_{\text{em}}]\{\mathbf{A}
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