Click and drag to place heat sources and experience Fourier's heat equation in real time. Freely change material, boundary conditions, and simulation speed to observe temperature field time evolution.
When applying a welding heat source (Q = 500W/mm) to a 10mm thick SS400 steel plate (α = 1.2×10⁻⁵ m²/s):
2DSimulator in Heat sourceplace,SteelMode「Velocity10x」do Diffusion behaviorConfirm.
Design Criteria: JIS Z 3001 (welding terminology), AWS D1.1 (structural welding code). Preheat temperature control prevents HAZ hardening and cracking.The core physics is described by the Fourier heat equation. For two-dimensional, unsteady (time-dependent) conduction, it governs how temperature T changes at every point (x,y) over time t.
$$ \frac{\partial T}{\partial t}= \alpha \left( \frac{\partial^2 T}{\partial x^2}+ \frac{\partial^2 T}{\partial y^2}\right) $$Where:
$T(x,y,t)$: Temperature at position (x,y) and time t [°C or K].
$t$: Time [s].
$\alpha$: Thermal diffusivity [m²/s]. This is the key parameter controlled by the Velocity slider.
$\frac{\partial^2 T}{\partial x^2}+ \frac{\partial^2 T}{\partial y^2}$: The Laplacian, a mathematical operator that sums the curvature (second spatial derivative) of temperature in all directions. It tells us how "bumpy" the temperature field is at a point.
The simulator solves this equation numerically by dividing the domain into a grid of cells. The rate of heat flow between cells is proportional to their temperature difference, a principle known as Fourier's Law of heat conduction.
$$ q = -k \, \nabla T $$Where:
$q$: Heat flux vector [W/m²], showing the direction and magnitude of heat flow.
$k$: Thermal conductivity [W/(m·K)].
$\nabla T$: Temperature gradient [K/m]. The negative sign indicates heat flows from hot to cold.
The interplay between this law (driving force) and the conservation of energy leads directly to the heat diffusion equation above.
Electronics Cooling: A primary use of 2D heat diffusion analysis is in designing circuit boards (PCBs). Engineers simulate heat spreading from hot components like CPUs to ensure temperatures stay within safe limits and to optimize heatsink and fan placement. The simulator's click-to-add-source feature mimics placing a hot chip on a board.
Building Science & Insulation: Analyzing heat flow through walls, windows, and roofs is essentially a 2D (or 3D) diffusion problem. Simulators help determine where thermal bridges (areas of rapid heat loss) occur, guiding the placement of insulation to improve energy efficiency in homes and commercial buildings.
Geothermal Studies: Understanding how temperature varies in the Earth's subsurface is crucial for geothermal energy harvesting. The diffusion equation models how heat from deep, hot rocks conducts towards the surface, informing where to drill wells for maximum energy extraction.
Materials Processing: During processes like welding, quenching, or additive manufacturing (3D printing), intense heat is applied to a specific area. Simulating the 2D diffusion of this heat is vital to predict and control the resulting material properties, such as hardness or residual stress, which determine the final product's strength.
When you start using this simulator, there are several points that beginners to CAE often stumble over. A major initial misconception is the image that "heat moves from a high-temperature area to a low-temperature area at a constant speed". Heat does not "flow"; it "diffuses" according to the temperature gradient. For example, if you create a small hot spot in steel, the temperature drops sharply right next to it, whereas in copper, the temperature distribution over the same distance will be much smoother. This is because the difference in thermal diffusivity α determines the "smoothness" of the temperature, a phenomenon that cannot be measured by speed alone.
Next is the tendency to underestimate the importance of boundary condition settings. While the simulator lets you choose "adiabatic" or "constant temperature", in practical work, this setting significantly influences the results. For instance, assuming the edge of a substrate is "adiabatic" will cause heat to build up, resulting in higher temperatures, but in reality, there might be heat dissipation from that edge to the case. Get into the habit of constantly asking, "What is the actual physical boundary condition?"
Finally, be aware of the gap between simulation "resolution" and "reality". This tool calculates using a 100x100 grid, but in practical CAE, the fineness of the mesh (grid) directly impacts result accuracy. For example, in areas with sharp geometry like the tips of a heat sink's fins, failing to use a finer mesh can lead to underestimating the actual temperature. Please remember that this tool is for learning principles, and its results cannot be used directly as design values.