EMI Filter Design
Theory: insertion loss and parasitics
Overview
Our power supply's conducted noise exceeds the limit. How should I choose a filter?
First measure how many dB you're short at which frequencies. Conducted noise covers 150 kHz–30 MHz; in switching supplies, differential-mode noise tends to dominate at low frequency and common-mode at high. An LC filter attenuates about 40 dB per decade above its corner, so L and C follow from the needed attenuation. But that applies to ideal parts; real inductors have inter-winding capacitance and capacitors have lead and electrode inductance. These make the filter nearly ineffective at high frequency, so design for both low-frequency attenuation and high-frequency parasitics.
Insertion loss
Ratio of load voltage without and with the filter. Source and load are both 50 Ω (the LISN value). A single stage with series L and shunt C on the load side: L = 100 μH, C = 1 μF.
Parasitics and self-resonance
C_p is inductor winding capacitance (20 pF); L_ESL and R_ESR are the capacitor's equivalent series inductance (15 nH) and resistance (10 mΩ).
Standards born to protect radio
International efforts to limit electrical-equipment noise began with CISPR, founded in 1934 to protect the then-spreading radio broadcasts from motor and lighting interference. The LISN inserted in power lines for conducted-noise measurement provides a 50 Ω reference so mains impedance doesn't vary from test to test. Filter performance is often compared on this 50 Ω basis.
Worked examples
Example 1: insertion loss, ideal vs with parasitics (L = 100 μH, C = 1 μF, corner 15.9 kHz)
| Frequency | Ideal | With parasitics | Winding capacitance only | ESL only |
|---|---|---|---|---|
| 150 kHz | 34.0 dB | 34.1 dB | 34.0 dB | 34.1 dB |
| 1 MHz | 65.9 dB | 74.3 dB | 66.6 dB | 73.6 dB |
| 5 MHz | 93.9 dB | 71.3 dB | 94.1 dB | 71.1 dB |
| 10 MHz | 105.9 dB | 53.8 dB | 89.1 dB | 70.6 dB |
| 30 MHz | 125.0 dB | 33.6 dB | 88.2 dB | 70.5 dB |
The inductor self-resonates at 3.56 MHz and the capacitor at 1.30 MHz. Near 1 MHz the capacitor approaches series resonance and attenuation actually increases, but above that both parasitics combine and attenuation drops sharply.
Example 2: getting 60 dB at 150 kHz
| Configuration | Components | IL at 150 kHz |
|---|---|---|
| 1 stage (baseline) | 100 μH + 1 μF | 34.0 dB |
| 1 stage (enlarged) | 473 μH + 4.73 μF | 60.0 dB |
| 2 stages | two sets of 100 μH + 1 μF | 72.7 dB |
Two stages of the same parts beat one stage of big parts.
One stage's attenuation rises with frequency squared but only in proportion to the LC product, so gaining 20 dB needs ten times the product. Two stages rise with frequency to the fourth power, and identical parts multiply their effect per stage. Large inductors need more turns and gain winding capacitance, hurting high-frequency performance, another reason to prefer more stages. Inter-stage resonance can occur, though, so damping resistors suppress the peaks. And however good the parts, if input and output wiring sit close and couple magnetically or electrically, noise jumps the filter. At high frequency, layout and grounding determine performance.
Design and analysis workflow
- Measure unfiltered noise separated into differential and common mode.
- Set required insertion loss per frequency from the margin to the limit plus headroom.
- Confirm insertion loss with circuit simulation including parasitics.
- Damp inter-stage resonances with resistors.
- Minimise input–output coupling and ground impedance by layout, then verify by measurement.
“A bigger choke made it worse”
A power supply exceeded the limit near 20 MHz. Swapping in a higher-inductance common-mode choke improved low frequencies but worsened 20 MHz. The bigger choke's many turns gave large winding capacitance, lowering self-resonance to a few MHz, so at 20 MHz it acted as a capacitor and passed noise. Adding a small high-frequency choke as a second stage brought 20 MHz within limits.
Common mistakes
Mistakes and fixes
| Mistake | Effect | Fix |
|---|---|---|
| Designing with ideal parts | Ineffective at high frequency | Include parasitics |
| Just enlarging L | Self-resonance drops | Add stages |
| Not separating modes | Wrong countermeasure | Separate DM and CM |
| Ignoring inter-stage resonance | Worse at certain frequencies | Add damping |
| Input and output wiring close | Noise bypasses filter | Separate the layout |
I'd like to learn related topics.
Related pages include conducted emission, CISPR standards, grounding and bonding, near-field coupling and PCB layout for EMC.
Related Topics
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