SI-Compliant PCB Design — Stackup, Impedance Control, and Wiring Topology Electromagnetic Field Simulation

Category: Electromagnetic Analysis – Signal Integrity | Revised 2026-10-01
SI-aware PCB design simulation showing stackup cross-section with impedance-controlled differential pairs and return path current distribution
SI-Compliant PCB Design: Impedance-controlled stackup cross-section and electromagnetic field distribution in differential pair routing

Theory: traces are transmission lines

Overview

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Do signals distort on a board because traces are too long?

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It depends not just on length but on how it compares with edge speed. If the signal changes more slowly than a round trip along the trace, the whole trace sits at nearly the same voltage and behaves as a wire. With faster edges, once the round trip takes longer, the trace becomes a transmission line and the signal travels as a wave that reflects wherever characteristic impedance changes. High-speed board design therefore keeps impedance uniform (often 50 Ω), matches impedance at the ends (termination) and checks whether lengths are short enough for reflections not to matter. Characteristic impedance follows from trace width, dielectric thickness and permittivity.

Microstrip characteristic impedance

$$ Z_0 = \frac{120\pi}{\sqrt{\varepsilon_{eff}}\left[\dfrac{w}{h} + 1.393 + 0.667\ln\!\left(\dfrac{w}{h} + 1.444\right)\right]},\quad \varepsilon_{eff} = \frac{\varepsilon_r + 1}{2} + \frac{\varepsilon_r - 1}{2}\left(1 + \frac{12h}{w}\right)^{-1/2}\quad (w/h \ge 1) $$

Hammerstad–Jensen formula (conductor thickness neglected). w is trace width and h dielectric thickness; a different form applies for w/h < 1.

Delay, critical length and reflection coefficient

$$ t_{pd} = \frac{\sqrt{\varepsilon_{eff}}}{c},\qquad l_{crit} \approx \frac{t_r}{2\,t_{pd}},\qquad \Gamma = \frac{Z_L - Z_0}{Z_L + Z_0} $$

t_r is rise time. Beyond l_crit, where the round-trip delay exceeds t_r, reflections appear as steps in the waveform.

Coffee Break Trivia

From telegraphy to high-speed digital

Transmission-line theory began with the telegrapher's equations developed in the 19th century by Heaviside and others to solve signal smearing on undersea telegraph cables. For a long time it concerned communications and broadcast engineers, but as digital rise times shrank to nanoseconds and then picoseconds, the same theory became necessary for board traces a few centimetres long. Today it's normal to compute characteristic impedance and set trace widths from the moment the board stackup is defined.

Worked examples

Example 1: trace width and impedance (FR-4, εr 4.3, 0.2 mm dielectric)

WidthImpedanceEffective εr
0.20 mm71.8 Ω3.11
0.30 mm58.3 Ω3.20
0.392 mm50.0 Ω3.27
0.50 mm42.9 Ω3.34

Delay of the 50 Ω line is 6.03 ps/mm (153 ps per inch).

Example 2: rise time and the length where reflections matter

Rise timeCritical length (round trip = t_r)Stricter rule (t_r/6)
1 ns82.9 mm27.6 mm
200 ps16.6 mm5.5 mm
50 ps4.1 mm1.4 mm

Example 3: 25 Ω driver, 50 Ω line, unterminated load (1 V step)

ArrivalLoad voltage
1st1.333 V
2nd0.889 V
3rd1.037 V
4th0.988 V
5th1.004 V

Source reflection coefficient is −1/3 and the open load +1. Sections of 40, 60 and 75 Ω in a 50 Ω line give reflection coefficients of −0.11, +0.09 and +0.20.

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The load overshoots by 33% and rings several times before settling.

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An unterminated load doubles and reflects the voltage, which returns to the driver where part reflects again. With the 25 Ω driver mismatched to the 50 Ω line, each round trip returns a wave multiplied by −1/3. Overshoot can exceed the receiver's voltage rating, and ringback can cross thresholds and cause errors. A simple fix is series termination: a 25 Ω resistor right after the driver matches the source to 50 Ω. A half-amplitude wave then launches, doubles at the load to exactly 1 V, and the returning wave is absorbed at the source, stopping the ringing. For traces with multiple loads, parallel termination with a 50 Ω resistor at the far end is used.

Design and analysis workflow

  1. Find critical length from rise time and identify traces to treat as transmission lines.
  2. Define the stackup and compute widths for target impedance.
  3. Choose termination to suit driver and load topology.
  4. Evaluate impedance discontinuities such as vias and connectors with field solvers.
  5. Measure prototypes with TDR to check impedance variation.
Coffee Break Trivia

“Worked in prototype, failed in production”

A board worked in prototype, but some production units had communication errors. The production fab's dielectric was thinner than the prototype's, giving about 42 Ω against a 50 Ω design. Mismatch with the termination resistor increased reflections, and a waveform with little margin crossed the threshold. Specifying controlled impedance (±10%) to the fab and requiring TDR test reports eliminated the errors.

Common mistakes

Mistakes and fixes

MistakeEffectFix
Judging by clock frequency onlyFast edges missedJudge by rise time
Uncontrolled dielectric thicknessImpedance driftsSpecify controlled impedance
Long unterminated tracesOvershoot and ringingSeries or parallel termination
Broken return pathImpedance jumpContinuous ground plane
Ignoring viasReflections at speedEvaluate by field solver
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